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ROHS reflow soldering

IMDES CONSENS-IT REFLOW OVEN VAPOR PHASE VP MINI JUMBO DINO

REFLOW SOLDERING OF SMD BOARDS

SMD REFLOW OVEN FOR PROTOTYPING

CONDEN-IT is a complete range of vapor phase reflow ovens dedicated to the manufacturing of prototype SMT boards.
These ovens are designed for remelting solder paste.

The ovens are ROHS compatibles.

CONDES-IT

   MINI OVEN CONDENSATION
   JUMBO OVEN CONDENSATION
   JUMBO + FUME EXTRACTOR
   DINO OVEN CONDENSATION
    KIT REWORK

Vapor phase model
Usable for soldering prototypes and small batches of PCB.
Setting is done via a programming display.

Description
The condensing table ovens are intended for use by laboratories, development offices and prototype manufacturers and small series of boards.
Components such as QFP, BGA, Flip-Chips and hybrids are treated flawless with excellent quality results.
Because of their small footprint, condensing ovens can be used anywhere.

The implementation is simple and fast.

Specifications
    - Top loader
    - Glass for seeing reflow process
    - Usable for BGA, QFP, ...
    - Soldering without oxygen
    - Transmission of the homogeneous temperature over the entire board
    - No more overheating of the components (plastic, connectors, switches, ...)
vapor phase reflow oven


REWORK COMPOSANT QFP BGA

A kit allows de-soldering of integrated circuits such as QFP or BGA. This kit is preferably used with the Large model.

    Kit de rework

SPECIFICATIONS
Specifications Model MINI Model JUMBO Model DINO
Fluid Galden LS230 for applications ROHS
Quantity; 0,5 Liter = 910 Grams
0,8 Liter 1,6 Liters
Cycle time 30 - 120 seconds depend on PCB same same
Heating time 15 minutes 25 minutes 35 minutes
Complete cycle 30 minutes 45 minutes 60 minutes
Soldering temperature 210 à 240 ºC (dépend on fluid) same same
Cooling air forced air forced air forced
Fluid quantity 350 à 500 ml of GALDEN 800 à 1350 ml of GALDEN 1600 à 1900 ml of GALDEN
Dimension PCB max ( L x W x H) 240 x 170 x 20 mm 430 x 230 x 20mm 580 x 460 x 20mm
Dimensions (L x W x H) 400 x 315 x 305 mm 605 x 385 x 450mm 840 x 640 x 460mm
Weight 6 kg 15kg 25kg
Electrical 230V 50Hz 230V 50Hz 230V 50Hz
Power 1000W / 5amp 2000W / 10amp 2500W / 10amp



HOW TO USE A CONDENSING OVEN

Example of reflow with SMD placement and coarse paste deposit



sérigraphie pour pose de pâte à braser pour carte CMS
MODEL MINI
sérigraphie pour pose de pâte à braser pour carte CMS
MODEL JUMBO
sérigraphie pour pose de pâte à braser pour carte CMS
MODEL DINO


Entrée du circuit imprimé dans la vague
Board support grid
Entrée du circuit imprimé dans la vague
Filling in Galden
Entrée du circuit imprimé dans la vague
Programming interface


Entrée du circuit imprimé dans la vague
Rework
Entrée du circuit imprimé dans la vague
Desoldering QFP BGA
Entrée du circuit imprimé dans la vague
QFP BGA tools


Entrée du circuit imprimé dans la vague

Option cover for Jumbo

By using a double-locked housing, the processing chamber will be protected from unwanted access or removal of the lid while the reflow process is in progress.
Entrée du circuit imprimé dans la vague
Cover open
Entrée du circuit imprimé dans la vague
Cover closed


What is vapour phase soldering?

Vapour phase is an alternative to air and IR reflow ovens. Vapour phase offers a better consistency in quality than small reflow ovens.
With vapour phase soldering, the PCB is submerged in hot Galden vapour. This vapour transfers heat to the PCB and melts the solder.
Because the Galden vapour is always at the same temperature, the process is very reliable. No components are overheated and no solderjoints are underheated.


How to use the Mini Condens-IT?

  • Poor the right amount of Galden in the bottom of the container. You only need to do this the first time before use.
  • Switch on the device.
  • Place the ready-to-solder PCB on the grid.
  • Close the lid and wait until the Standby LED is green.
  • You can start the soldering process by pressing the start button.
  • The Galden at the bottom of the container is now heated and the vapour will rise until above the PCB.
  • When the device registers that the vapour has risen above the PCB, it will shut down the heating and it starts cooling the container with fans.
  • The vapour will condense and will flow back into the bottom of the container.
  • You can take out the soldered PCB now. Use protective gloves, because it is still hot.
  • The whole process only takes about 10 minutes. The Galden liquid needs to be purchased separately. You need a minimum of 350ml to use the Mini Condens-IT. Each soldering cycle a few ml of Galden gets used up.
    Over use the Galden will get contaminated with solder residue. You can simply filter the Galden with a paper filter (like a coffee filter).