Reflow Oven forced covection FT03. ADVANCED

RohS reflow soldering process

FT03.ADVANCED

This reflow oven is compatible with Rohs lead-free technologies.

CIF FT03.ADVANCED "Made in France"

Documentation Four de polymérisation pour composants électroniques CMS

FT03 oven has been conceived to the reflow of solder paste or polymerization of the glues for prototyping.
FT03 oven is compatible with high temperature alloys and above all "lead free" ones thanks to its new heating system as well as its electronics.

Forced convection reflow oven for prototypes and small series.
It includes in line many functions as 10 programs memorization, information display upon LCD monitor, a viewing window to supervise the process.

View of the PCB thanks to a large glass window on the front panel

Possibility to keep in memory 10 reflow profiles programs

Compact model, but working area of 190 x 290 mm

Heating through forced convection

Temperature control by microprocessor, max. T° 300°C

Digital display of different advises: temperature and time

Easy programming for immediate control

Safety: double glass window with air circulation, closing door access

Four de polymérisation pour composants électroniques CMS

Specifications FT03.ADV

Model	FT03.ADV
Reference	V900323
Heating	2 levels
Temperature control	micro computer
Working temperature	up to 300°C
Working area	190 x 290 mm
PCB max size	100 x 160 mm
Quartz heating elements	2 x 1 KW
Software SMTix-2.0	Included
Thermal stabilisation	about 3 minutes
Dimensions ext. L x D x H	300 x 420 x 385 mm
Weight:	19 kg
Power supply:	220VAC / 16 Amp / 50-60Hz