Dispensing    Solder paste printing    SMD placement    Reflow oven    Profiler

Reflow Oven forced covection FT03. ADVANCED

RohS reflow soldering process


This reflow oven is compatible with Rohs lead-free technologies.

CIF FT03.ADVANCED    "Made in France"

  Documentation Four de polymérisation pour composants électroniques CMS

FT03 oven has been conceived to the reflow of solder paste or polymerization of the glues for prototyping.
FT03 oven is compatible with high temperature alloys and above all "lead free" ones thanks to its new heating system as well as its electronics.

Forced convection reflow oven for prototypes and small series.
It includes in line many functions as 10 programs memorization, information display upon LCD monitor, a viewing window to supervise the process.

  • View of the PCB thanks to a large glass window on the front panel
  • Possibility to keep in memory 10 reflow profiles programs
  • Compact model, but working area of 190 x 290 mm
  • Heating through forced convection
  • Temperature control by microprocessor, max. T° 300°C
  • Digital display of different advises: temperature and time
  • Easy programming for immediate control
  • Safety: double glass window with air circulation, closing door access

  • Four de polymérisation pour composants électroniques CMS Specifications FT03.ADV
    Reference V900323
    Heating 2 levels
    Temperature control micro computer
    Working temperature up to 300°C
    Working area 190 x 290 mm
    PCB max size 100 x 160 mm
    Quartz heating elements 2 x 1 KW
    Software SMTix-2.0 Included
    Thermal stabilisation about 3 minutes
    Dimensions ext. L x D x H 300 x 420 x 385 mm
    Weight: 19 kg
    Power supply: 220VAC / 16 Amp / 50-60Hz