It is a manual bonding machine designed for prototyping and small series that
allows high precision and high technology in bonding with a very limited
investment.
The machine puts no technological limits to the kind of boards you need to
bond.
Driven by a touch screen monitor, it can easily be adapted to any kind of
material and lay up. The highest registration accuracy is obtained by means of
the same lay up table of the bigger models with 2 or 4 registration pins.
All heads are individually controlled.
MBM-5000 uses the HF Pulse Bonding technology developed by Piergiacomi. This
technology allows bonding of thick books up to over 10mm at a very high speed
and with a very low energy consumption.
TECHNICAL FEATURES:
Maximum panel dimensions: 820x640mm
Minimum panel dimensions: 280x250mm
Maximum book thickness: 10mm
Average cycle time for 6 layers: 30 sec.
Maximum settable time: 600 sec.
Number of welding points SBH1000: min 4 (2+2) max 8 (4+4)
Number of sensors TH100: min 1 max 4
Maximum power absorbed by 4 welding points: 500 W
Maximum power absorbed by 8 welding points: 1000 W
Average power: 300 W
Power supply: 230 Volt
Air compressed consumption: 30 Nl / min.
Maximum pressure air supply: 0.7 Mpa
Weight: 350 Kg
Dimensions: 186x116x133cm
CE marked